NO
Item
Craft Ability
1
Surface Finish
HASL, Immersion Gold, Flash Gold, Gold Plating, OSP, Immersion Tin etc.
2
Layer
2-30 layers
3
Minimum Line width
3mil
4
Minimum Line ***ce
3mil
5
Min ***ce between pad to pad
3mil
6
Minimum hole diameter
0.10 mm
7
Min bonding pad diameter
10mil
8
Max proportion of drilling hole and board thickness
1:12.5
9
Max size of finish board
23inch*35inch
10
Rang of finish board¡¯s Thickness
0.21-7.0mm
11
Minimum thickness of solder mask
10um
12
Soldermask
Green,Yellow, Black, Blue, White, Red,
tran***rent photosensitive, soldermask, Strippable soldermask
13
Minimum line width of Idents
4mil
14
Min Height of Idents
25mil
15
Color of silk-screen
White,Yellow,Black
16
Date file format
GERBER FILE and DRILLING FILE, PROTEL SERIES,
PADS2000 SERIES, Powerpcb SERIES£¬ ODB++
17
E-Testing
100% E-Testing; High Voltage Testing
18
Material for PCB
High Tg Material; High Frequence£¨ROGERS ,TEFLON ,
TACONIC ,ARLON) ; Halogen-free Material
19
Other test
Impedance, Testing, Resistance, Testing, Microsection etc.,
20
Special technological requirement
Blind & Buried Vias and High Thickness copper |
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